bonding pad
英 [ˈbɒndɪŋ pæd]
美 [ˈbɑːndɪŋ pæd]
焊盘；键合点；焊接区
双语例句
- This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.
这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。 - A main character in ultrasonic wire bonding is the welding formation in the contact area. The character shows that the welding area locates only at the periphery of the contact area, although the contact area between the wire and pad is much larger.
在超声波线焊中，虽然金线和焊接平台间的接触界面较大，但实验显示，焊接部位只发生在接触截面的周边，这是一种特别的焊接界面形态和超声波线焊的机理。 - This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。 - The influence of junction area and bonding pad size on the dark current has been also analyzed.
文中还对器件结面积和电极尺寸等对暗电流的影响进行了比较和分析。 - New Type Roller Contour of Bonding Pad Roll for SSAW Pipe Unit
新型螺旋焊管机组焊垫辊辊型 - The circuit is simulated with models of bonding wire, pad and ESD circuits.
在混频器的设计与仿真过程中，同时考虑到了压焊线、焊盘、ESD电路的影响。 - Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。 - The results show that the volume of solder, interstice height, and size of bonding pad have a remarkable effect on the 3-D shapes of LCCC solder joint.
结果表明，钎料体积、间隙高度、焊盘尺寸对LCCC焊点三维形态有显著的影响。 - Layer thickness analysis results from a bonding pad on a circuit board, showing nanometer resolution thickness analysis.
来自电路板结合区的厚度分析，纳米尺度的厚度分析。 - This technology can be widely used for chip encapsulation in the field of micro-electronics. The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip.
这一技术可以广泛应用于微电子行业中的芯片封装技术，它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。